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System-in-Package RF Design and Applications

 

 

System-in-Package RF Design and Applications

by Michael P. Gaynor 

2007 (240 pages)

ISBN:9781580539050

Offering a solid grasp of RF components together with state-of-the-art packaging strategies, this practical guide will help you meet today’s increasingly demanding requirements for reliability, manufacturability, RF performance, size, and cost.

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System-in-Package RF Design and Applications

Preface

Chapter 1

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Introduction

Chapter 2

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SiP Substrate Options

Chapter 3

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Assembly Process

Chapter 4

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Advanced Packaging Techniques

Chapter 5

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System Architecture Issues/Concerns

Chapter 6

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RF Design and Simulation Tips

 

Chapter 7

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Advanced RF Design Techniques

 

Chapter 8

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A Case Study and Thoughts on the Field's Future

Appendix