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Adhesives Technology for Electronic Applications—Materials, Processes, Reliability

Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

by James J. Licari and Dale W. Swanson

2005 (477 pages)

ISBN:9780815515135

Containing over 80 tables and 120 figures which provide a wealth of data on properties, performance, and reliability, this comprehensive book covers all aspects of adhesive technology for microelectronic devices and packaging.

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Adhesives Technology for Electronic Applications—Materials, Processes, Reliability
Preface
Chapter 1	-	Introduction
Chapter 2	-	Functions and Theory of Adhesives
Chapter 3	-	Chemistry, Formulation, and Properties of Adhesives
Chapter 4	-	Adhesive Bonding Processes
Chapter 5	-	Applications
Chapter 6	-	Reliability
Chapter 7	-	Test and Inspection Methods
Appendix