Adaptive Cooling of Integrated Circuits Using Digital Microfluidics | by Krishnendu Chakrabarty, Philip Y. Paik and Vamsee K. Pamula | ISBN: 9781596931381. Microfluidic Chip Design Reference. Thermal Management of Integrated Circuits. IC Cooling Techniques. Adaptive Hot-Spot Cooling.
Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
by Krishnendu Chakrabarty, Philip Y. Paik and Vamsee K. Pamula
ISBN:9781596931381
For IC engineers grappling with high power dissipation and thermal issues, this definitive guide will prove invaluable in tackling IC heat issues that existing methods can no longer address.
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Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
Preface
Chapter 1 – Thermal Management of Integrated Circuits
1.1: Introduction
1.2: Low-Level Power Consumption in Integrated Circuits
1.3: Circuit-Level Power Consumption in Integrated Circuits
1.4: Low-Power Interconnect Design
1.5: Low-Power Memory Design
1.6: Real-World Example—The Pentium M Processor
1.7: Summary
References
Chapter 2 – Cooling Devices for Integrated Circuits
2.1: Introduction
2.2: Design Considerations for IC Cooling
2.3: Categorization of IC Cooling Techniques
2.4: Current Methods for IC Cooling
2.5: Summary and Conclusions
References
Chapter 3 – Adaptive Hot-Spot Cooling Principles and Design
3.1: Introduction
3.2: Requirements for Adaptive Hot-Spot Cooling
3.3: Digital Microfluidics as a Cooling Platform
3.4: Feedback Control Mechanisms
3.5: IC Level Integration
3.6: Performance Comparisons for Flow-through Methods
3.7: Summary and Conclusions
References
Chapter 4 – Technology Development
4.1: Introduction
4.2: Temperature Measurement
4.3: Hot-Spot Source Design
4.4: Capacitance Detection
4.5: Design, Fabrication, and Testing of Initial Flow-Through Prototypes
4.6: Digital Microfluidics on Printed Circuit Board (PCB)
4.7: Summary and Conclusions
References
Chapter 5 – Thermal Effects of Digital Microfluidic Devices
5.1: Introduction
5.2: Experimental Methods
5.3: Experimental Results for a System in Oil
5.4: Experimental Results for a System in Air
5.5: Summary and Conclusions
References
Chapter 6 – Flow-Through—Based Adaptive Cooling
6.1: Introduction
6.2: Experimental Methods
6.3: Digital Microfluidic PCB Platform Development
6.4: Hot-Spot Cooling in an Open System
6.5: Hot-Spot Cooling in a Closed System
6.6: Static Heat Transfer Characterization
6.7: Summary and Conclusions
Chapter 7 – Programmable Thermal Switch—Based Adaptive Cooling
7.1: Introduction
7.2: Experimental Methods
7.3: Mercury Droplet Transport
7.4: Steady-State Heat Transfer of Hot Spots Using Mercury
7.5: Transient Heat Transfer of Hot Spots Using Mercury
7.6: Summary and Conclusions
Reference
Chapter 8 – Concluding Remarks
Overview
8.1: Summary of Concepts
8.2: Future Work
Appendix A – Image Analysis Software Using MATLAB
A.1: Introduction
A.2: Video Frame Handling
A.3: Processing Video for Temperature Measurement
Appendix B – Microfluidic Chip Design Reference
Appendix C – RTD/Heater Top Plate Design Reference
Appendix D – Material Data Safety Sheet: Mercury
D.1: Product Identification
D.2: Composition/Information on Ingredients
D.3: Hazards Identification
D.4: First Aid Measures
D.5: Fire Fighting Measures
D.6: Accidental Release Measures
D.7: Handling and Storage
D.8: Exposure Controls/Personal Protection
D.9: Physical and Chemical Properties
D.10: Stability and Reactivity
D.11: Toxicological Information
D.12: Ecological Information
D.13: Disposal Considerations
D.14: Transport Information
D.15: Regulatory Information
D.16: Other Information
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