Microelectronics Books. Semiconductor Engineering Books. Power Electronics Semiconductor Devices | by Robert Perret | 2009 | ISBN: 9781848210646. Power MOSFET Technologies. Insulated Gate Bipolar Transistors. Technology for Silicon Carbide Power Components

December 12, 2009 by kutenk
Filed under: Engineering Books 

Power Electronics Semiconductor Devices

by Robert Perret
2009 (567 pages)
ISBN:9781848210646

Dedicated to power electronics switches and their uses, this book represents a summary of research carried out in French and international laboratories in the early years of the 21st century.

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Power Electronics Semiconductor Devices







Preface
Overview
References




Chapter 1 – Power MOSFET Transistors
1.1: Introduction
1.2: Power MOSFET Technologies
1.3: Mechanism of Power MOSFET Operation
1.4: Power MOSFET Main Characteristics
1.5: Switching Cycle with an Inductive Load
1.6: Characteristic Variations Due to MOSFET Temperature Changes
1.7: Over-Constrained Operations
1.8: Future Developments of the Power MOSFET
1.9: References

Chapter 2 – Insulated Gate Bipolar Transistors
2.1: Introduction
2.2: IGBT Technology
2.3: Operation Technique
2.4: Main IGBT Characteristics
2.5: One Cycle of Hard Switching on the Inductive Load
2.6: Soft Switching Study
2.7: Temperature Operation
2.8: Over-Constraint Operations
2.9: Future of IGBT
2.10: IGBT and MOSFET Drives and Protections
2.11: References

Chapter 3 – Series and Parallel Connections of MOS and IGBT
3.1: Introduction
3.2: Types of Associations
3.3: The Study of Associations: Operation and Parameter Influence on Imbalances in Series and Parallel
3.4: Solutions for Design
3.5: References

Chapter 4 – Silicon Carbide Applications in Power Electronics
4.1: Introduction
4.2: Physical Properties of Silicon Carbide
4.3: State of the Art Technology for Silicon Carbide Power Components
4.4: Applications of Silicon Carbide in Power Electronics
4.5: Conclusion
4.6: Acknowledgments
4.7: References



Chapter 5 – Capacitors for Power Electronics
5.1: Introduction
5.2: The Various Components of the Capacitor — Description
5.3: Stresses in a Capacitor
5.4: Film Capacitors
5.5: Impregnated Capacitors
5.6: Electrolytic Capacitors
5.7: Modeling and Use of Capacitors
5.8: Ceramic Capacitors
5.9: Specific Applications of Ceramic Capacitors in Power Electronics
5.10: R&D Perspectives on Capacitors for Power Electronics
5.11: References




Chapter 6 – Modeling Connections
6.1: Introduction
6.2: The Method of Modeling
6.3: The Printed Circuit Board
6.4: Towards a Better Understanding of Massive Interconnections
6.5: Experimental Validations
6.6: Using these Models
6.7: Conclusion
6.8: References

Chapter 7 – Commutation Cell
7.1: Introduction: A Well-Defined Commutation Cell
7.2: Some More or Less Coupled Physical Phenomena
7.3: The Players in Switching (Respective Roles of the Component and its Environment)
7.4: References

Chapter 8 – Power Electronics and Thermal Management
8.1: Introduction: The Need for Efficient Cooling of Electronic Modules
8.2: Current Power Components
8.3: Power Electronic Modules
8.4: Laws of Thermal and Fluid Exchange for Forced Convection with Single Phase Operation
8.5: Modeling Heat Exchanges
8.6: Experimental Validation and Results
8.7: Conclusion
8.8: References



Chapter 9 – Towards Integrated Power Electronics
9.1: The Integration
9.2: Examples and Development of Functional Integration
9.3: Integration of Functions within the Power Component
9.4: Design Method and Technologies
9.5: Conclusion
9.6: References

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