Integrated Circuit Packaging, Assembly and Interconnections | by William J. Greig | ISBN: 9780387281537. Advanced Microelectronics. Electronic Manufacturing. IC MANUFACTURING TECHNOLOGIES. HDI Substrate Manufacturing Technologies. Thin Film Technology

Integrated Circuit Packaging, Assembly and Interconnections

by William J. Greig
ISBN:9780387281537

Covering the technical issues and some of the reliability concerns, this guide provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.

Get this Book by clicking below:

Integrated Circuit Packaging, Assembly and Interconnections







Preface
Chapter 1 – Electronic Manufacturing and the Integrated Circuit
1: MICROELECTRONICS AND THE TRANSISTOR [1]
REFERENCES

Chapter 2 – Integrated Circuit Manufacturing—A Technology Resource
2: IC MANUFACTURING TECHNOLOGIES
REFERENCES

Chapter 3 – Packaging the IC—Single Chip Packaging
3: THE IC PACKAGE [1,2]
REFERENCES

Chapter 4 – The Chip Scale Package
4: THE CHIP SCALE PACKAGE, CSP
REFERENCES

Chapter 5 – Multichip Packaging
5: MULTICHIP PACKAGING (MCP) [1,2]
REFERENCES

Chapter 6 – Known Good Die (KGD)
6: THE KGD STORY [1]
REFERENCES

Chapter 7 – Packaging Options—Chip on Board
7: DIRECT CHIP ATTACH (DCA) AND CHIP ON BOARD (COB)
REFERENCES

Chapter 8 – Chip & Wire Assembly
8: CHIP & WIRE ASSEMBLY [1]
REFERENCES

Chapter 9 – Tape Automated Bonding—TAB
9: BACKGROUND—MINIMOD [1,2]
REFERENCES

Chapter 10 – Flip Chip—The Bumping Processes [1–4]
10: BACKGROUND
REFERENCES

Chapter 11 – Flip Chip Assembly
11: BASIC FLIP CHIP ASSEMBLY [1–4]
REFERENCES

Chapter 12 – HDI Substrate Manufacturing Technologies—Thin Film Technology
12: HIGH DENSITY PACKAGE/SUBSTRATE MANUFACTURING TECHNOLOGIES
REFERENCES

Chapter 13 – HDI Substrate Manufacturing Technologies—Thick Film Technology
13: THICK FILM TECHNOLOGY
REFERENCES

Chapter 14 – HDI Substrate Manufacturing Technologies—Cofired Ceramic
14: THE COFIRED CERAMIC TAPE TECHNOLOGY [1]
REFERENCES

Chapter 15 – Substrate Manufacturing Technologies—Organic Packages and Interconnect Substrate
15: THE LEVEL 2.0 PRINTED WIRING BOARD [1,2]
REFERENCES

Acronyms and Definitions
Microelectronics Glossary

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  • Auto-Identification and Ubiquitous Computing Applications: RFID and Smart Technologies for Information Covergence | by Judith Symonds, John Ayoade and David Parry (eds) | 2009 | ISBN: 9781605662985. IT Reference Source. Computer Reference Source. Radio Frequency Identification
  • WiMAX RF Systems Engineering | by Abate. Zerihun | 2009 | ISBN: 9781596939752. Mobile Communications Library. WiMAX Radio Design. WIMAX Network Planning. WiMAX Security Standard. UMTS and WiMAX Comparison. Radio Frequency Network Planning and Deployment.
  • Foundations of Quantum Mechanics: From Photons to Quantum Computers | by Reinhold Blümel | 2010 | ISBN: 9780763776282. Optimal Interaction-Free Measurements. Classical and Quantum Circuits. Ion-Trap Quantum Computers. Quantum Cryptography. Grover's Search Algorithm.
  • RF Power Amplifier Behavioral Modeling | by Dominique Schreurs, Máirtín O'Droma, Anthony A. Goacher and Michael Gadringer (eds) | 2009 | ISBN: 9780521881739. Circuit-Level Power Amplifier Models. Digital-Logic Simulation. Analogue-Signal Behavioural Simulators for Wireless Communication Systems
  • C++ Programming for the Absolute Beginner, Second Edition | by Mark Lee | 2009 | ISBN: 9781598638752. How To Design Software using Object-Oriented Programming. The Software Development Cycle. Software Design Best Practices. Programming On Mac Os X. Programming On Linux.

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• This Month's Popular Posts

  • Different Types of Risk. Operational Risk. Strategic Business Risk. Reputational Risk.
  • Understand CHIEF OPERATIONS OFFICER's Key ROLES AND RESPONSIBILITIES
  • BUSINESS MODEL OF THE FIRM. Four types of business model change strategies. Nine basic business model building blocks.
  • Common Types of Operational Risk. Internal fraud.External fraud.Legal and liability losses.Noncompliance with regulations.System failures.Inappropriate business practice.
  • 5 Legal Elements of Fraud. How Fraud investigators look for evidence of intent to defraud.
  • ERP Books. SAP MM Questions and Answers | by Kogent Learning Solutions, Inc. | 2010 | ISBN: 9780763781446. SAP Materials Management. Materials Requirement Planning. mySAP ERP Applications. Inventory Management. Procurement and Purchasing Management.
  • Questionnaire Design: How to Plan, Structure and Write Survey Material for Effective Market Research, Second Edition | by Ian Brace | ISBN: 9780749450281. E-Marketing Research Books. Online Survey Design. RECRUITMENT Survey QUESTIONNAIRES. CUSTOMER SATISFACTION RESEARCH
  • 8 Sales Forecasting Techniques.Marketing models.Statistical demand analysis.Subjective methods of forecasting.Derived demand.Smoothing.Decomposition analysis.
  • Materials Selection in Mechanical Design, Third Edition | by Michael F. Ashby | ISBN: 9780750661683. Materials Science Books. Engineering Materials. Material Property Charts. Designing Hybrid Materials
  • Strategic Information Management: Challenges and Strategies in Managing Information Systems, Third Edition | by Robert D. Galliers and Dorothy E. Leidner (eds) | ISBN: 9780750656191. Strategic Information Systems. Information Systems Planning Process. Information Systems–Business Strategy Alignment
  • Enterprise Resource Planning Books. SAP SD Questions and Answers | by Kogent Learning Solutions, Inc. | 2010 | ISBN: 9780763781989. Sales and Distribution (SD) Module in an ERP System
  • Quality Management Essentials. Key Concepts, Pros and Cons of Total Quality Management (TQM)
  • Digital Signal Processing: Fundamentals and Applications | by Li Tan | ISBN: 9780123740908. Electrical Engineering Books. DSP Applications. Digital Filter Design. Hardware and Software for Digital Signal Processors. Adaptive Filters
  • Project Scheduling and Cost Control: Planning, Monitoring and Controlling the Baseline | by James C. Taylor | ISBN: 9781932159110. Project Managemet Books. Project Tools and Templates. TECHNIQUES FOR COMPRESSING THE SCHEDULE AND LEVELING RESOURCES. PROJECT RESOURCE PLANNING
  • Fundamentals of Momentum, Heat, and Mass Transfer, Fourth Edition | by James R. Welty et al. | ISBN: 9780471381495. Radiation Heat Transfer. Turbulence on Momentum Transfer. Convective Heat Transfer. HEAT EXCHANGER ANALYSIS AND DESIGN
  • Five Characteristics of Good Training. Improve Workplace Performance with Business Goals Alignment.
  • The Financial Management of Hospitals and Healthcare Organizations, Fourth Edition | by Michael Nowicki | ISBN: 9781567932775. Medicare and Medicaid. How to Set Charges in Healthcare. How to Manage Accounts Receivable. Materials and Inventory Management. Financial Analysis and Management Reporting
  • E-Banking Management: Issues, Solutions, and Strategies | by Mahmood Shah and Steve Clarke (eds) | 2009 | ISBN: 9781605662527. E-Banking Technologies. E-Banking Project Management. Delivery of Retail Banking Services. TOOLS FOR MANAGING E-BANKING
  • Fraud Risk Assessment: Building a Fraud Audit Program | by Leonard W. Vona | ISBN: 9780470129456. Fraud Management Books. Payroll Fraud Schemes. Fraud Risk Control Strategy. Sample Fraud Audit Report. Travel Expense Concealment Strategies. Fraud in Expenditure. Contract Fraud Audit Plan
  • Digital Modulation Techniques, Second Edition | by Fugin Xiong | ISBN: 9781580538633. Optical Communications Books. Digital Communication Systems. Orthogonal Frequency Division Multiplexing. Quadrature Amplitude Modulation. Frequency Shift Keying. Phase Shift Keying